Ultrabarrier encapsulation, barrier coating, Atomic Layer Deposition (ALD)
Thanks to its innovative Atomic Layer Deposition (ALD) technology, Encapsulix has the solution to the universal problem of corrosion barriers and encapsulation for the OLED, Flexible Organic Electronic, Data Storage, Photovoltaic and Industrial Films. Our patented injector, reaction chamber and gas dosing system allows for infinite geometric scaling of the reaction space and substrate, optimized cost of ownership and exceptional barrier performance.
Encapsulix was founded to address the geometric scaling of critical Atomic Layer Deposition (ALD) requirements for industrial & microelectronic devices and foils. Initial process focus is in thin Al2O3, TiO2 and ZnO specifically for encapsulation and barrier coatings. Our research and applications lab in France has the state or the art ALD deposition equipment as well as a complete metrology and analysis capability. Our headquarters and research center is located in southern France, product development in CA and sales and service in NY USA. Our management team has over 100 years of semiconductor and microelectronic thin film equipment experience.
We serve the thin film barrier and encapsulation equipment demands for the OLED lighting and display, photovoltaic, data storage, architectural glass, data storage and generic large area microelectronic markets.