Innovation in Atomic Layer Deposition Technology
ALD (Atomic Layer Deposition) is the sequential introduction of propagating waves of metal and oxygen precursors yielding angstrom level process thickness control. Encapsulix’s innovation has decreased the cycle time and increased the substrate size capability of the ALD process dramatically.
Encapsulix Innovation: An assembly of modular precursor dosers and gas injectors that behave as a monolithic “unit”
- Assemble application-specific systems based on common technology bricks
- Factor of 5-100 throughput increase through massive parallel deployment
- Commonality in hardware, Process between R&D, Prototype, Manufacturing
Economic large area atomic scale barrier film deposition