Encapsulix announced today the sale of an Infinity^tm 500 manufacturing equipment to a leading OLED lighting manufacturer for Atomic Layer Deposition Encapsulation.
The Infinity^tm 500 has been developed utilizing Encapsulix’s patented & proprietary Atomic Layer Deposition technology. The Infinity^tm 500 product family deposits barrier and encapsulation films on substrates up to 500mm x 400mm and is the work horse for Gen2 OLED applications. The order received from a leading OLED lighting manufacturer is scheduled to be delivered end of 2013. The system provides the best ultrabarrier performance and cost of ownership for the manufacturing of OLED devices. The Infinity^tm 1000 for Gen5 and 5.5 will be introduced in 2014 along with the Infinity tm Flex500 and 1000 for flexible organic substrates and rolls.

Encapsulix has been selected as one of 28 promising young innovative companies operating in the green & smart city sector, to present at the Greencity Investment Forum (GIF), which will take place on October 18, 2013 in Marne-la-Vallée, Paris.

This event convenes leading entrepreneurs, investors and experts from Eco-Technology, Eco-Mobility, Eco-Construction and Eco-City sectors throughout Europe.

Encapsulix introduces the Parallel Precursor Wave (PPW) ALD equipment technology. The essential mechanism of deposition is a chemical process of two gases reacting on the surface forming a thin layer of barrier material; this is done repeatability until the desired thickness is achieved. The Encapsulix innovation is the development of a system that yields a moving or propagating wave of gas confined in a N2 gas pulse. This wave of reactive gas scans across the substrate at 20 meters/sec with no moving parts or substrate. The simplicity of the techniques is borne from the injection, gas dosing and system configuration. It is superior in production applications to the much more complex and reliability plagued moving substrate or moving injector head technologies. Furthermore this proprietary technology has a modular system which allows us to build ALD reactors for substrates which are practically infinitely scalable and having throughputs that are orders of magnitude higher than those of conventional or competing ALD systems. The ensuing Cost of Ownership improvement makes next generation encapsulation technology economically feasible, providing an immediate path to significant gains in device durability and financial viability.